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  • Sputtering Targets and
    Evaporation Materials
  • Target Bonding
  • Backing Plates
  • Fabrication and
    Quality Control
  • General Materials List
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  • 944 System
  • ELAS System
  • R&D System
  • Asher System
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R&D System

 

System can be configured to meet customers individual requirements. If it requires a vacuum and a plasma ESC will help you configure a system.

Features

• Load lock system
• Multi target system
• Co sput of up to three materials (RF or DC) plus substrate bias
• RF Etch station in load lock
• 8" substrates
• Full recipe control